Automotive NPI Packaging Engineer, up to Sr. Staff (Hsinchu) (3076553)

【本職缺優先審核至高通官網投遞人選】請至高通官網上傳英文履歷表：https://careers.qualcomm.com/careers/job/446706064863

【Job Summary】

• Keyword: Automotive, NPI, DFM methodology, assembly FMEA, package assembly process flow, material set -Travel will be focus support in Asia, such as Taiwan, China, Korea, Vietnam
• Leading programs working with US staff and ultimately management and growth of a team in Taiwan to support automotive NPI and HVM sustaining activities

【Responsibilities】

• Responsible for exploring, defining business justification, development and HVM deployment of Automotive Package and Module packaging technologies.
• Responsible for defining package assembly process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable Chipset/Module products.
• Interface with OSATs/CMs and component suppliers in developing technology related to OSAT/SiP product requirements. Align with internal product teams.
• Work with internal design team and drive DFM methodology for new technologies. Support and maintain internal assembly FMEA for product development.
• Work with internal design, modeling and procurement teams to implement technically best and lowest cost packaging options.
• Technical program management to plan, execute, and monitor complex process or product developments. Regular updates on program status to management.