工作類別: pcb佈線工程師
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美商集成全球科技股份有限公司
Substrate Layout Engineer
IC package substrate design and layout 1.1. Package type includes flip-chip and wirebond. Single die design and multi-die design 1.2. Substrate layer count from 2 layers to 20+ …
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[新北市新店區 Xindian District, New Taipei City]