We are looking for 2D/2.5D/3D-IC thermal integrity design talent, who is well-experienced at thermal/mechanical design at standard package (HFCBGA/SiP) and advanced package …
General OSC/PLL/DLL/SSCG/CDR design & production experience
LC-tank VCO design & production experience CDR design & production experience
類比電路開發設計與佈局優化(Bandgap, LDO, Charge Pump等類比電路) 非揮發性記憶體電路開發設計(Array, Decoding, Sense Amplifier等電路) 消費性、物聯網與車用電子之非揮發性記憶體電路整合開發設計 Our Design Team is responsible for NVM …
Job Requirements:
Master or PhD degree in EE is required as a minimum from a reputed college. Experienced in CMOS LNA, Mixer, PA. T/R Switch block design and trade-offs Experienced …
Job Description: (1) High-speed ADC/DAC design. (a) Research different ADC architectures (including DSM, SAR, Pipeline etc.) (b) Build an ideal model of ADC (c) Realize blocks in …
General Solution Architect / Execution PM
※Job Contents
Handle project execution & management for advanced ASIC chip from Netlist-in to GDSII tapeout and silicon bring-up at …