類比電路開發設計與佈局優化(Bandgap, LDO, Charge Pump等類比電路) 非揮發性記憶體電路開發設計(Array, Decoding, Sense Amplifier等電路) 消費性、物聯網與車用電子之非揮發性記憶體電路整合開發設計 Our Design Team is responsible for NVM …
1.Tapeout with multi-million gates count SOC design on cutting-edge technologies. 2.Develop UDSM design methodology for timing/power/reliability/DFM closures and low power designs. …
We are looking for 2D/2.5D/3D-IC thermal integrity design talent, who is well-experienced at thermal/mechanical design at standard package (HFCBGA/SiP) and advanced package …
• Work closely with customers to architect system solutions that incorporate Infineon’s DCDC controller portfolio of Hot-swap controllers, e-Fuse, and digital DCDC …
【本職缺優先審核至高通官網投遞人選】請至高通官網上傳英文履歷表:https://qualcomm.wd12.myworkdayjobs.com/External/job/Hsinchu-City-TWN/Module-Component-SQE–Staff_3068979 【Talents who apply job through …
Create end-user documentation and support other R&D and market communications materials. Typical documents include hardware installation guides, software configuration guides, …
A new product concept is being developed, and you’ll provide input on technical challenges. As the concept takes shape, you will advise on PCB requirements and components in …
We are looking for a EE engineer (7-10 yrs of experience) for our HW and Operation team in Taiwan. The ideal candidate should have the following technical skills and experience: …