[PI] F16 Sr. Process Integration Manager 資深製程整合經理

Job Description- In this position, you will participate in new technology node transfer, derivative DID enablement/safe launch, inline I-spec/E-spec identification and line management, networking activities and definition of performance indices (metrics). As this is a generic job profile to define the job responsibility, your supervisors will communicate with you to define specific job profiles with mission assignment. Responsibilities and Tasks - Lead integration team for new technology transfer and derivative DIDs enablement (cross-Fab) planning and execution. Accountable for Part-Type-Owner role and resource arrangement Cross site process flow management, definition and optimization Inline and electrical product SPEC identification and deliver clear/right target to process team Cross site integration process matching and gap closure Responsible for Quality, Output, Cost program meeting business plan Model-bases-Problem-Solving mindset deployment, enhance domain knowledge, technical expertise, explore innovation opportunities with strategic thinking. Open-minded relationship with cross function peers/leaders, frequently communication with Central team. TD, DEG, GQ, etc. Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals. Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles. Business travel is possible for face to face work with central team or other Fab peer groups. Frequently 1:1 with leaders and skip level communication, understand the need and support team to meet business plan Set suitable and deliverable performance/development goal for yourself and leaders/team members for annual performance rating reference Strategy of successor development plan for your current position and M1/Lead. As this is a generic description of job responsibilities, your supervisors will communicate to define specific tasks. Requirements - Growth mindset and transform business thinking logic Knowledge in Semiconductor DRAM process flows, and Fabrication. Understanding of DRAM operation and structure to decipher parametric, probe and backend data. Advance sub-20nm (1x, 1y, 1z, 1a, 1b, 1r) DRAM cross node process integration knowledge and pilot run experience. Ability of automatic system development for baseline maintain efficiency improvement is extra plus. Model-Based-Problem-Solving mindset for troubleshooting, reporting and presentation skills. Good multi-tasking, verbal and written communication skills. Strong interpersonal skills and customer/co-worker relationships and demonstrate teamwork skills. Good organizational capabilities and ability to work effectively with minimal supervision. Negotiation and persuasion capability for cross function business communication. Education - Master’s degree and above in Electrical Engineering, Microelectronics, Physics, or related field of study.