情報源 Source: 104
Tomofun_友愉股份有限公司
Sr. Frontend Engineer
【 Application Channel 】 Please apply via: https://grnh.se/403f05c83us
【 About the company 】 At Tomofun, we LOVE pets and technology. Our vision is to bring joy and innovation to …
年薪900,000~1,300,000元
[台北市松山區 Songshan District, Taipei City]
情報源 Source: 104
長頸鹿美語_台中市私立丹尼爾美語短期補習班
PT - Foreign Teacher (English teacher))-北屯水湳
We’re a looking for a Foreign teacher who comes from an English-speaking country， to teach elementary school and junior high school students English.
1.Location: Beitun district …
時薪600~700元
[台中市北屯區 Beitun District, Taichung City]
情報源 Source: 104
優必達台灣有限公司
Project Manager 專案管理師
[Position Summary] The project manager will handle the communication with customer and engineer. Clarify the project scope/specification. Manage the development schedule and …
待遇面議
[台北市信義區 Xinyi District, Taipei City]
情報源 Source: 104
巴旺塞柏德克有限公司
Full Stack Developer (AI)
As a Full Stack Developer, you will play a critical role in the development, and deployment of new AI product. You will work closely with our cross-functional team of engineers, …
待遇面議
[台北市中山區 Zhongshan District, Taipei City]
情報源 Source: 104
優必達台灣有限公司
Cloud Solution Project Manager 雲端架構專案管理師
[Position Responsibilities]
Clarify the customer requirement and specification to figure out the system proposal. Manage the internal system development spec and schedule. …
待遇面議
[台北市信義區 Xinyi District, Taipei City]
情報源 Source: 104
緯創軟體股份有限公司
A－Sr. Ruby on Rails （RoR） Engineer （遠端）
The Sr Engineer R&D Software Engineering will provide software design, development, and application support for the TAP (Trial Application Platform) for both currently released …
待遇面議
[新北市汐止區 Xizhi District, New Taipei City]
情報源 Source: 104
巴旺塞柏德克有限公司
AI engineer
As an AI Engineer, you will play a pivotal role in the development, deployment, and integration of cutting-edge AI solutions into our products. You will work closely with our …
待遇面議
[台北市中山區 Zhongshan District, Taipei City]
情報源 Source: 104
美商集成全球科技股份有限公司
Substrate Layout Engineer
IC package substrate design and layout 1.1. Package type includes flip-chip and wirebond. Single die design and multi-die design 1.2. Substrate layer count from 2 layers to 20+ …
待遇面議
[新北市新店區 Xindian District, New Taipei City]