Staff Failure Analysis Engineer

Synaptics is looking for an experienced Staff Failure Analysis Engineer to lead complex electrical, mechanical, and material-level investigations to determine root cause of failures in semiconductor devices and systems. The ideal candidate has deep expertise in analytical techniques, strong problem-solving skills, and the ability to collaborate cross-functionally with design, process, test, and reliability teams to drive corrective actions and improve product quality and reliability

Job Duties:

  • Analyze customer RMAs to determine electrical, material, and process-related root causes of failures across product lines including wireless, automotive, touch (TDDI and DDIC), video interface, audio DSP, and SoC products
  • Perform detailed failure analysis on devices in the New Technology Introduction (NTI) phase to identify potential reliability or design weaknesses early in the product lifecycle
  • Partner with Design, Application, Process, Foundry, Product, and Package Engineering teams to drive root cause identification and develop corrective and preventive actions (CAPA)
  • Generate data-driven Failure Analysis (FA) reports that clearly document findings, conclusions, and recommendations
  • Meet cycle time and quality commitments for Synaptics Automotive Product FA deliverables
  • Support continuous improvement initiatives to enhance FA methodologies, tools, and efficiency

Competencies:

  • Deep understanding of semiconductor device physics and mixed-signal failure mechanisms
  • Strong technical understanding of analog and mixed-signal circuit analysis and layout
  • Analytical rigor and systematic problem-solving
  • Excellent troubleshooting skills and structured root-cause analysis capability
  • High focus on quality, speed, and continuous improvement
  • Proactive and self-driven, able to work independently in a fast-paced environment
  • Excellent organizational, planning, and documentation skills with high attention to detail
  • Positive attitude and work ethic; unafraid to ask questions and explore new ideas
  • Resourceful and analytical and able to solve complex problems and use data to improve processes and provide guidance
  • Strong verbal, and written communication skills in English (Japanese is a plus); clear, concise technical communication
  • Ability to work collaboratively and influence within a diverse global cross-functional team

Qualifications:

  • Bachelor’s degree (master’s a plus) in Engineering, Physics, or a related field or equivalent
  • 8+ years of experience in Failure Analysis, Process Engineering, or Product Engineering in the semiconductor industry
  • Proven experience in TDDI and DDIC failure analysis
  • Proficiency in operating and interpreting results from FA equipment such as EMMI, OBIRCH, SEM, FIB, TEM, and X-ray, with a strong understanding of their underlying principles
  • Hands-on experience performing bench-level electrical debug and characterization using oscilloscopes, function generators, source meters, and other common lab instruments
  • Demonstrated ability to apply 8D problem-solving methodologies for automotive products
  • Failure analysis experience with 28nm and more advanced product is a plus
  • Fab or assembly process experience is a plus
  • Travel internationally up to 10% based on business needs